ZSSC3122AI2T
IDT, Integrated Device Technology Inc
Deutsch
Artikelnummer: | ZSSC3122AI2T |
---|---|
Hersteller / Marke: | IDT (Renesas Electronics Corporation) |
Teil der Beschreibung.: | TSSOP / 14 / 4,4MM G1 - TUBE |
Datenblätte: | None |
RoHs Status: | Lead free / RoHs compliant |
ECAD -Modell: | |
Zahlungsmittel: | PayPal / Credit Card / T/T |
Versandweg: | DHL / Fedex / TNT / UPS / EMS |
Aktie: |
Ship From: Hong Kong
Online -RFQ -Einreichungen: Schnelle Antworten, bessere Preise!
Produkteigenschaften | Eigenschaften |
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Spannungsversorgung | 1.8V ~ 5.5V |
Supplier Device-Gehäuse | 14-TSSOP |
Serie | RBicLite™ |
Verpackung / Gehäuse | 14-TSSOP (0.173", 4.40mm Width) |
Paket | Tube |
Produkteigenschaften | Eigenschaften |
---|---|
Befestigungsart | Surface Mount |
Schnittstelle | I²C, SPI |
Grundproduktnummer | ZSSC3122 |
Anwendungen | Sensor Signal Conditioner - Resistive |
ZSSC3122_3123KIT EVALUATION KIT
DICE (WAFER SAWN) - FRAME
WAFER (UNSAWN) - BOX
DICE (WAFER SAWN) - FRAME
ZSSC3122 MASS CALIBRATION SYSTEM
DICE (WAFER SAWN) - FRAME
IC INTFACE SPECIALIZED SGNL COND
OPN - WAFER (UNSAWN) - BOX
TSSOP / 14 / 4,4MM G1 - TAPE&REE
IC CAP SENSOR SIGNAL CONDITIONER
WAFER (UNSAWN) - BOX
WAFER (UNSAWN) - BOX
DICE (WAFER SAWN) - FRAME
SSC BOARD ZSSC3122_3123 V1.0 W.
IC INTFACE SPECIALIZED SGNL COND
IC INTFACE SPECIALIZED SGNL COND
IC INTERFACE
IC INTFACE SPECIALIZED SGNL COND
TSSOP / 14 / 4,4MM G1 - TAPE&REE
DICE (WAFER SAWN) - WAFFLE PACK
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![]() ZSSC3122AI2TIDT, Integrated Device Technology Inc |
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